150*300 cm(L*w)
150*300 cm(L*w)
150*300 cm(L*w)
150*300 cm(L*w)
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150*300 cm(L*w)
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150*300 cm(L*w)
Phenolic and hard paper
fiberglass resin binder
Phenolic and hard paper
Phenolic and hard paper
Capabilities
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| Specifications | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Specification Name | Spec | Photo | |||||||||
| Minimum Board Dimension | 10mm * 10mm |  | |||||||||
| Board Layers | 1 & 2 Layers. |  | |||||||||
| Copper Weight | 1oz(35um) | ||||||||||
| Board Thickness Tolerance | ± 15% | ||||||||||
| Minimum trace spacing/width | 0.4 mm |  | |||||||||
| Annular Rings | 0.6 mm |  | |||||||||
| Minimum distance between Trace and Copper Pour | 0.4 mm |  | |||||||||
| Circuit to edge | 0.4 mm |  | |||||||||
| Minimum distance between Vias (plated holes) | 0.4 mm |  | |||||||||
| Minimum distance between Silk Screen and Solder Pad | 0.4 mm |  | |||||||||
| Width of Solder Mask Dam | 0.4 mm |  | |||||||||
| Minimum distance between Via(plated holes) and trace | 0.6 mm |  | |||||||||
| Drill Hole Diameter(Mechanical) | 0.4-6.3 mm |  | |||||||||
| Minimum diameter for Vias | 0.8 mm | |
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Frequently
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For instant quotes we require dxf files exported from flatcam software . Please find the following video guide on how to export dxf files for pcb isolation milling from gerber files
If you not comfortable with this process download sample files (dxf ) and upload Additionally upload your gerber files in zip file format at checkout page “upload “ field.Or drop an email with query to fmservices@aicadtbaramatifoundation.org we will back you soon.